The PS5 SoC uncovered: these photos show even the layer of liquid metal that acts as a heat sink
Sony engineers long ago boasted what was the inside of the PS5 likebut they never gave too many specific details about the processor of this console.
Now we have images that “strip” that SoC and they show it to us in great detail.
The SoC of the PS5, naked
They were taken by a photographer named Fritzchens Fritz, and in them that liquid metal layer that Sony has used instead of the traditional thermal paste to dissipate the heat generated by this chip.
The images of the “die” that accompany this peculiar photographic report also show the distribution of the different components of the SoC with all its functional blocks.
In the image, taken with a special microscope which makes use of short wave infrared light (SWIR), the author also indicated these blocks to identify them.
Thus, it is possible to identify eight cores of the PS5 processor on the left side, with the 36 Compute Units in the middle of the die. You can see other important elements such as its eight GDDR6 memory interfaces.
Compared to a traditional AMD Zen 2 APU there is no room for items like the FFU (Fixed Function Unit) or the FMA (Fused Multiply-Add) that they are not useful on a console like this.
That image contrasts with the one that Microsoft did share when talking about the Soc of its Xbox Series X, which as seen in the slide has a somewhat different disposition although it is also based on an AMD APU with Zen 2 architecture.